Apple Rumored to Upgrade PCB Materials for iPhone 16 Models in 2024
Apple has decided to postpone its adoption of resin-coated copper (RCC) components in upcoming iPhone models iPhone 17.
Recently, there were rumors circulating that Apple planned to introduce new resin-coated copper (RCC) components in upcoming iPhone models, aiming to make them slimmer and more streamlined. Originally anticipated for the iPhone 16 series this year, this innovative design change was reportedly pushed back to the iPhone 17 lineup expected in 2025. However, according to respected Apple analyst Ming-Chi Kuo, these plans have once again been delayed. Allegedly, concerns over the durability and fragility of RCC components have led Apple to reconsider incorporating them into future iPhone models.
Analyst Ming-Chi Kuo recently revealed on X (formerly Twitter) that Apple has once again postponed its plans to integrate RCC (Resin-Coated Copper) components into future iPhone models. According to Kuo, “Due to challenges meeting Apple’s stringent quality standards, the upcoming iPhone 17 in 2025 will not adopt RCC as its PCB motherboard material.”
The potential switch from current copper-clad laminate (CCL) to RCC was aimed at reducing mainboard size and thickness, potentially allowing for larger batteries in future iPhone models. However, concerns over RCC’s durability and fragility seem to have led to this delay. Initially rumored for the iPhone 16 lineup in 2024, the transition to RCC was later pushed back to the iPhone 17 series.
However, plans have shifted due to technological challenges. According to insights from Weibo’s “Mobile Chip Expert,” the 2nm chipset’s mass production won’t be feasible until late 2025. As a result, this advancement is now slated for the iPhone 18 series, expected in 2026.
Recent reports suggest that Apple is planning to streamline its iPhone 17 series for 2025, potentially introducing a high-end model named Slim. Speculations gained traction following the release of a slim iPad Pro earlier this year. Initial rumors hinted at a 2nm chipset for lineup, although recent developments indicate possible adjustments to these plans.
The upcoming iPhone 17 series is rumored to continue utilizing TSMC’s advanced 3nm process node. Although TSMC plans to begin mass production of 2nm chips next year, recent reports suggest they are fast-tracking development to ensure stable output. The 2nm technology promises notable improvements, offering either a 10-15% increase in speed at the same power consumption or a 25-30% reduction in power usage compared to TSMC’s current 3nm process.
In the current lineup, the A17 Pro chip powers the iPhone 15 Pro models, fabricated on TSMC’s first-generation 3nm process, while the M4 chipset utilizes the second-generation 3nm node. Looking ahead, the iPhone 16 series, expected this year, will feature the A18 chip built on TSMC’s second-generation 3-nanometer process.
Kuo did not speculate on whether RCC might debut with the iPhone 18 in 2026 or iPhone 19 in 2027. As Apple has not confirmed plans to switch to RCC materials, these developments should be viewed with caution.
Initially slated for the iPhone 16, the anticipated technology upgrade has been pushed back to the iPhone 17. This delay means that the wait for thinner iPhones will be extended. Analyst Ming-Chi Kuo hasn’t confirmed whether Apple will introduce this technology in 2026, leaving uncertainty about when we can expect slimmer iPhones.
Apple’s upcoming iPhone 17 series, expected in 2025:
Apple’s 2025 iPhone lineup is rumored to feature four models: the iPhone 17, 17 Slim (possibly replacing the Plus variant), 17 Pro, and 17 Pro Max. These models are set to debut with a refreshed design, enhancements to the front-facing camera, and a smaller Dynamic Island. The 17 Pro versions are expected to be equipped with Apple’s A19 Pro chip, while the regular 17 and 17 Slim could be powered by either the A18 or A19 chip.
